Bicheng Technologies Limited

M4, TC350

Manufacturer from China
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2 Years
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Double Layer Rogers PCB Built on 12.7mil RO4003C LoPro Reverse Treated Foil for High Speed Back Planes

Double Layer Rogers PCB Built on 12.7mil RO4003C LoPro Reverse Treated Foil for High Speed Back Planes

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Brand Name :Bicheng Technologies Limited
Model Number :BIC-0129-N0.129
Certification :UL
Place of Origin :China
MOQ :1
Price :USD9.99-99.99
Payment Terms :T/T/Paypal
Supply Ability :50000 pieces per month
Delivery Time :10 working days
Packaging Details :Vacuum
NUMBER OF LAYERS :2
GLASS EPOXY :RO4003C LoPro
FINAL HEIGHT OF PCB :0.6mm
FINAL FOIL EXTERNAL :1.0oz
SURFACE FINISH :Immersion Gold
SOLDER MASK COLOR :N/A
COLOUR OF COMPONENT LEGEND :N/A
TEST :100% Electrical Test prior shipment
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Double Layer Rogers PCB Built on 12.7mil RO4003C LoPro Reverse Treated Foil for High Speed Back Planes.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard

RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity

while maintaining all other desirable attributes of the standard RO4003C laminate system.

Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

Lead-free process compatible

1. High temperature processing

  • Meets environmental concerns

CAF resistant

Double Layer Rogers PCB Built on 12.7mil RO4003C LoPro Reverse Treated Foil for High Speed Back Planes

Our PCB Capability (RO4003C LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

  • Cellular base station antennas and power amplifiers
  • LNB’s for direct broadcast satellites
  • RF Identification Tags

Typical Properties of RO4003C LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 40 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 X 1010 MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 X 109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40) MPa(kpsi) IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280 °C TMA A IPC-TM-650 2.4.24.3
Td 425 °C TGA ASTM D3850
Thermal Conductivity 0.64 W/m/°K 80°C ASTM C518
Moisture Absorption 0.06 % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79 gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0) N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-Free Process Compatible Yes


Double Layer Rogers PCB Built on 12.7mil RO4003C LoPro Reverse Treated Foil for High Speed Back Planes

China Double Layer Rogers PCB Built on 12.7mil RO4003C LoPro Reverse Treated Foil for High Speed Back Planes for sale

Double Layer Rogers PCB Built on 12.7mil RO4003C LoPro Reverse Treated Foil for High Speed Back Planes

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