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Bicheng Technologies Limited

City:hong kong

Province/State:guangdong

Country/Region:china

Contact Person:MrsNatalie Xue

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China DiClad 527 High Frequency PCB (DiClad 527 HF PCB) is a custom-made printed circuit board (PCB) product wholesale

DiClad 527 High Frequency PCB (DiClad 527 HF PCB) is a custom-made printed circuit board (PCB) product

Name: DiClad 527 High Frequency PCB DiClad 527 HF PCB is a custommade printed circuit board PCB product
Brand: BICHENG
Price: 0.99 USD

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Brand Name :BICHENG

Model Number :BIC-NX.221-221

Certification :UL, ISO9001

Place of Origin :CHINA

MOQ :1 piece

Price :0.99-99.99

Payment Terms :T/T

Supply Ability :50000 pieces per month

Delivery Time :8-9working days

Packaging Details :vaccum

Board Thickness :0.635mm

Copper Thickness :1oz

Layer :2

Manufacturer :BICHENG

Material :DiClad 527

Min Hole Size :0.41mm

Min Trace Width/Spacing :6/6mil

Model :BIC-N05-16

Package :Carton box

Product Name :Rogers 3006 PCB

Quantity :50000pcs

Silkscreen Color :no

Solder Mask Color :no

Surface Finish :ENIG

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View Product Description

DiClad 527 High Frequency PCB (DiClad 527 HF PCB) is a custom-made printed circuit board (PCB) product. The provided

picture and parameters serve as reference only.

Substrate Introduction:

Rogers DiClad 527 laminates are composite materials reinforced with woven fiberglass, primarily used as substrates in PCBs.

These laminates have a higher proportion of fiberglass reinforcement compared to PTFE content. This balanced ratio results

in a wider range of dielectric constant (Dk), improved dimensional stability, and registration.

Standard Panel Sizes for DiClad 527:

18" x 12" (457 x 305mm)
18" x 24" (457 x 610mm)

Standard Thicknesses for DiClad 527:

0.020" (0.508mm) with a tolerance of +/- 0.0020"
0.030" (0.762mm) with a tolerance of +/- 0.0020"
0.060" (1.524mm) with a tolerance of +/- 0.0020"

Standard Claddings for DiClad 527:

Electrodeposited Copper Foil
1/2 oz. (18µm)
1 oz. (35µm)

For information on other available PCB configurations, such as additional thicknesses, panel sizes, and claddings, please

contact our Customer Service or Sales Engineering teams.

Key Features:

Dk range: 2.40 to 2.60
Low dissipation factor: 0.0018 at 10GHz
Low moisture absorption

Key Benefits:

Stable Dk across a wide frequency range
Low circuit losses at high frequencies
Minimal performance variation in high humidity environments
Excellent dimensional stability
Consistent product performance
Uniform electrical properties across frequencies
Reliable mechanical performance
Excellent chemical resistance

Our PCB Capability (DiClad 527)

PCB Material:	Woven Fiberglass/PTFE composite
Designation:	DiClad 527
Dielectric constant:	2.40-2.60 10GHz/23˚C
Dissipation factor	0.0017 10GHz/23˚C
Layer count:	Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness	20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

Typical Applications:

Radar feed networks
Commercial phased array networks
Low-loss base station antennas
Guidance systems
Digital radio antennas
Filters, couplers, and LNAs

DiClad 527 Data Sheet

Typical Value
Properties		DiClad 527	Units	Test Conditions		Test Method
Electrical Properties
Dielectric Constant		2.40-2.60	-	23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant		2.40-2.60	-	23˚C @ 50% RH	1 MHz	IPC TM-650 2.5.5.3
Dissapation Factor		0.0017		23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
Dissapation Factor		0.0010		23˚C @ 50% RH	1 MHz	IPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric Constant		-153	ppm/˚C	-10 to 140˚C	10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity		1.2 x 109	MΩ-cm	C96/35/90	-	IPC TM-650 2.5.17.1
Surface Resistivity		4.5 x 107	MΩ	C96/35/90	-	IPC TM-650 2.5.17.1
Dielectric Breakdown		>45	kV	D48/50	-	ASTM D-149
Arc Resistance		>180		-	-	ASTM D-495
Thermal Properties
Coefficient of Thermal Expansion - x		14	ppm/˚C	-	50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y		21	ppm/˚C	-	50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z		173	ppm/˚C	-	50˚C to 150˚C	IPC TM-650 2.4.24
Thermal Conductivity		0.26	W/(m.K)			ASTM E1461
Mechanical Properties
Copper Peel Strength		14	Lbs/in	10s @288˚C	35 μm foil	IPC TM-650 2.4.8
Young’s Modulus		517, 706	kpsi	23˚C @ 50% RH	-	ASTM D-638
Tensile Strength (MD, CMD)		19.0, 15.0	kpsi	23˚C @ 50% RH	-	ASTM D-882
Compressive Modulus		359	kpsi	23˚C @ 50% RH	-	ASTM D-695
Flex Modulus		537	kpsi	23˚C @ 50% RH		ASTM D-3039
Physical Properties
Flammability		V-0			C48/23/50 & C168/70	UL 94
Moisture Absorption		0.03	%	E1/105+D24/23		IPC TM-650 2.6.2.2
Density		231	g/cm³	C24/23/50	Method A	ASTM D792
NASA Outgassing	Total Mass Lost	0.02	%	125°C, ≤ 10-6 torr		NASA SP-R-0022A
	Collected Volatiles	0.00	%
	Water Vapor Recovered	0.01	%

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