F4BTM300 PCB 2-layer, 40 mil thick, immersion gold, suitable for radar, microwave, and RF applications

F4BTM300 PCB 2-layer, 40 mil thick, immersion gold, suitable for radar, microwave, and RF applications

Introduction of F4BTM300:
Wangling's F4BTM300 laminates are meticulously crafted by blending fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin through precise pressing processes. Leveraging the F4BM dielectric layer as a foundation,

the F4BTM300 series integrates high dielectric and low loss nano-level ceramics, enhancing the dielectric constant, heat resistance, thermal expansion coefficient, insulation resistance, and thermal conductivity while preserving low loss attributes.

F4BTM300 and F4BTME300 share a common dielectric layer but differ in copper foils: F4BTM employs ED copper foil,

suitable for applications not requiring PIM compliance, while F4BTME is paired with reverse-treated (RTF) copper foil,

ensuring superior PIM performance, precise line control, and reduced conductor loss.

Features of F4BTM300:

• Dielectric constant (Dk) of 3.0 at 10GHz
• Dissipation factor of 0.0018 at 10GHz
• Thermal expansion coefficient (CTE) in x-axis: 15 ppm/°C, y-axis: 16 ppm/°C, z-axis: 78 ppm/°C (-55°C to 288°C)
• Low thermal coefficient of Dk at -78 ppm/°C (-55°C to 150°C)
• Moisture absorption of less than 0.05%
• UL-94 V0 flammability rating

PCB Stackup:

• 2-layer rigid PCB
• Copper layer 1: 35 μm
• F4BTM300 Core: 1.016 mm (40mil)
• Copper layer 2: 35 μm
• PCB Construction Details:
• Board dimensions: 84.33mm x 59.5mm, 2 pieces, with a tolerance of ±0.15mm
• Minimum Trace/Space: 4/6 mils
• Minimum Hole Size: 0.3mm
• No blind vias
• Finished board thickness: 1.1mm
• Finished Cu weight: 1oz (1.4 mils) on outer layers
• Via plating thickness: 20 μm
• Surface finish: Immersion gold
• Top Silkscreen: White
• Bottom Silkscreen: None
• Top Solder Mask: Black
• Bottom Solder Mask: None
• 100% Electrical test conducted before shipment

PCB Statistics:

• Components: 16
• Total Pads: 47
• Thru-Hole Pads: 32
• Top SMT Pads: 15
• Bottom SMT Pads: 0
• Vias: 31
• Nets: 2

Additional Information:

1. Artwork Format: Gerber RS-274-X
2. Quality Standard: IPC-Class-2 compliant
3. Availability: Worldwide

Typical Applications:

• Microwave, RF, and radar systems
• Phase shifters
• Power dividers, couplers, combiners
• Feed networks
• Phase-sensitive antennas, phased array antennas
• Satellite communications
• Base station antennas

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