Bicheng Technologies Limited
M4, TC350
Add to Cart
PCB with high frequency Rogers RO4350B 60 mil 1oz copper thickness PCB layout for RF
Circuit Board Patch Antenna
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for
reference)
Superior High-Frequency Performance: RO4350B laminates are engineered to provide exceptional
high-frequency performance, making them ideal for applications requiring reliable signal integrity at
elevated frequencies.
Cost-Effective Circuit Fabrication: These laminates offer a cost-effective solution for circuit fabrication,
balancing high performance with affordability.
Suitability for RF Microwave Circuits: RO4350B material is well-suited for RF microwave circuits,
matching networks, and controlled impedance transmission lines due to its specific properties and
performance capabilities.
Low Dielectric Loss: The material's low dielectric loss allows for its use in various applications where
conventional circuit board materials may be limited at higher operating frequencies, enabling efficient
signal transmission and reduced signal degradation.
Stability of Dielectric Constant: With a stable dielectric constant over a broad frequency range and
one of the lowest temperature coefficients of dielectric constant among circuit board materials,
RO4350B ensures reliable performance and consistent signal characteristics across different
frequency bands.
Similar Expansion Coefficient to Copper: RO4350B's expansion coefficient closely matches that of copper,
ensuring excellent dimensional stability. This characteristic is essential for constructing mixed dielectric
multi-layer boards.
Low Z-axis CTE: The material's low Z-axis Coefficient of Thermal Expansion (CTE) guarantees dependable
plated through-hole quality, even under extreme thermal shock conditions, enhancing the overall robustness
of the PCB.
High Glass Transition Temperature (Tg): With a Tg exceeding 280°C, RO4350B maintains stable expansion
characteristics throughout the entire range of PCB processing temperatures, contributing to its reliability and
performance during manufacturing processes.
RO4350B PCB Specifications
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID
Data sheet of Rogers 4350B (RO4350B )
| PCB SIZE | 135 x 135mm=1PCS |
| BOARD TYPE | High frequency PCB, RF PCB |
| Number of Layers | Double sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+PLATE |
| RO4350B 60mil | |
| copper ------- 35um(1oz)+PLATE | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 11mil/12mil |
| Minimum / Maximum Holes: | 0.3/2.2mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | 184 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B 60mil, Tg 288℃ |
| Final foil external: | 1.5oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel) |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |