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Premium-quality PCB components Rogers 20 mil 0.508 mm RO4350B RF microwave PCB
without splitter impedance control
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for
reference)
RO4350B hydrocarbon ceramic laminates are engineered to provide exceptional high-frequency
performance and cost-effective circuit fabrication. As operational frequencies surpass 500 MHz,
the range of available laminates for designers diminishes significantly. RO4350B possesses the
essential properties required by designers working on RF microwave circuits, matching networks,
and controlled impedance transmission lines. Its low dielectric loss enables the utilization of
RO4350B in numerous applications where conventional circuit board materials face limitations
at higher operating frequencies.
The temperature coefficient of dielectric constant is among the lowest of any circuit board material,
and the dielectric constant is stable over a broad frequency range. RO4350B material's thermal
coefficient of expansion (CTE) provides several key benefits to the PCB designers. The expansion
coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent
dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The
low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal
shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain
stable over the entire range of PCB processing temperatures.
PCB Specifications
PCB SIZE | 26 x 83mm=1PCS |
BOARD TYPE | |
Number of Layers | Double sided PCB, 2 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | no |
LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
RO4350B 20mil (0.508mm) | |
copper ------- 35um(1oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 5.98mil/6.18mil |
Minimum / Maximum Holes: | 0.3/3.2mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 431 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | no |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | RO4350B 20mil (0.508mm), Tg 288℃ |
Final foil external: | 1.5oz |
Final foil internal: | 0oz |
Final height of PCB: | 0.6mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (81.1%) 2µ" over 100µ" nickel |
Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH) |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID
Data sheet of Rogers 4350B (RO4350B )
RO4350B Typical Value | |||||
Property | RO4350B | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 390 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
Flammability | (3)V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |