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PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, 50mil, 60mil,
with tolerances of 0.6mm for PCB thickness for satellite
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Material Composition: Rogers TMM4 is a ceramic, hydrocarbon, thermoset polymer composite tailored
for high plated-through-hole reliability in stripline and microstrip applications, with a dielectric constant
of 4.70.
Benefits: TMM4 amalgamates the advantages of ceramic and traditional PTFE microwave circuit materials,
without necessitating specialized production techniques. Unlike some materials, it does not need a sodium
napthanate treatment before electroless plating.
Thermal Properties: TMM4 boasts an impressively low thermal coefficient of dielectric constant, typically
below 30 PPM/°C. Its isotropic coefficient of thermal expansion closely mirrors that of copper, enabling
the creation of dependable plated through-holes and minimal etch shrinkage.
Thermal Conductivity: The material offers a thermal conductivity roughly double that of conventional PTFE
/ceramic materials, aiding in effective heat dissipation.
Thermoset Resins: TMM4, being based on thermoset resins, retains its structural integrity when exposed to
heat. Consequently, wire bonding of component leads to circuit traces can be conducted without worrying
about pad lifting or substrate deformation.
Our PCB Capability (TMM4)
PCB Material: | Composite of Ceramic, hydrocarbon and thermoset polymer |
Designator: | TMM4 |
Dielectric constant: | 4.5 ±0.045 (process); 4.7 (design) |
Layer count: | 1 Layer, 2 Layer |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP. |
Typical Applications
Chip testers
Dielectric polarizers and lenses
Filters and coupler
Global Positioning Systems Antennas
Patch Antennas
Power amplifiers and combiners
RF and microwave circuitry
Satellite communication systems
Data Sheet of TMM4
Property | TMM4 | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess | 4.5±0.045 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant,εDesign | 4.7 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | +15 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
Volume Resistivity | 6 x 108 | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | 1 x 109 | - | Mohm | - | ASTM D257 | |
Electrical Strength(dielectric strength) | 371 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
Thermal Properties | ||||||
Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - x | 16 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Y | 16 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Z | 21 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | 0.7 | Z | W/m/K | 80 ℃ | ASTM C518 | |
Mechanical Properties | ||||||
Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | 15.91 | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | 1.76 | X,Y | Mpsi | A | ASTM D790 | |
Physical Properties | ||||||
Moisture Absorption (2X2) | 1.27mm (0.050") | 0.07 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.18 | |||||
Specific Gravity | 2.07 | - | - | A | ASTM D792 | |
Specific Heat Capacity | 0.83 | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |