Bicheng Technologies Limited

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PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness

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Bicheng Technologies Limited
City:hong kong
Province/State:guangdong
Country/Region:china
Contact Person:MrsNatalie Xue
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PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness

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Brand Name :Bicheng Technologies Limited
Model Number :BIC-0103-N0.103
Certification :UL
Place of Origin :China
MOQ :1
Price :USD9.99-99.99
Payment Terms :T/T/Paypal
Supply Ability :50000 pieces per month
Delivery Time :10 working days
Packaging Details :Vacuum
NUMBER OF LAYERS :2
GLASS EPOXY :TMM4,Composite of Ceramic, hydrocarbon and thermoset polymer
FINAL HEIGHT OF PCB :0.6 mm ±0.1
FINAL FOIL EXTERNAL :1.0oz
SURFACE FINISH :Immersion Gold
SOLDER MASK COLOR :White
COLOUR OF COMPONENT LEGEND :NO
TEST :100% Electrical Test Prior Shipment
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PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, 50mil, 60mil,

with tolerances of 0.6mm for PCB thickness for satellite

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Material Composition: Rogers TMM4 is a ceramic, hydrocarbon, thermoset polymer composite tailored

for high plated-through-hole reliability in stripline and microstrip applications, with a dielectric constant

of 4.70.


Benefits: TMM4 amalgamates the advantages of ceramic and traditional PTFE microwave circuit materials,

without necessitating specialized production techniques. Unlike some materials, it does not need a sodium

napthanate treatment before electroless plating.


Thermal Properties: TMM4 boasts an impressively low thermal coefficient of dielectric constant, typically

below 30 PPM/°C. Its isotropic coefficient of thermal expansion closely mirrors that of copper, enabling

the creation of dependable plated through-holes and minimal etch shrinkage.


Thermal Conductivity: The material offers a thermal conductivity roughly double that of conventional PTFE

/ceramic materials, aiding in effective heat dissipation.


Thermoset Resins: TMM4, being based on thermoset resins, retains its structural integrity when exposed to

heat. Consequently, wire bonding of component leads to circuit traces can be conducted without worrying

about pad lifting or substrate deformation.

Our PCB Capability (TMM4)

PCB Material: Composite of Ceramic, hydrocarbon and thermoset polymer
Designator: TMM4
Dielectric constant: 4.5 ±0.045 (process); 4.7 (design)
Layer count: 1 Layer, 2 Layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

Typical Applications

Chip testers

Dielectric polarizers and lenses

Filters and coupler

Global Positioning Systems Antennas

Patch Antennas

Power amplifiers and combiners

RF and microwave circuitry

Satellite communication systems

PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness

Data Sheet of TMM4

Property TMM4 Direction Units Condition Test Method
Dielectric Constant,εProcess 4.5±0.045 Z 10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 4.7 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +15 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 6 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 1 x 109 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 371 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 16 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 16 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 21 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.91 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.76 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.07 - % D/24/23 ASTM D570
3.18mm (0.125") 0.18
Specific Gravity 2.07 - - A ASTM D792
Specific Heat Capacity 0.83 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness

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