Bicheng Technologies Limited

M4, TC350

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Materials for RF laminates constructed on Taconic RF-35TC PCB Manufacturer 30 mil 0.762 mm with black soldermask

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Bicheng Technologies Limited
City:hong kong
Province/State:guangdong
Country/Region:china
Contact Person:MrsNatalie Xue
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Materials for RF laminates constructed on Taconic RF-35TC PCB Manufacturer 30 mil 0.762 mm with black soldermask

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Brand Name :Bicheng Technologies Limited
Model Number :BIC-026-N0.26
Certification :UL
Place of Origin :China
MOQ :1
Price :USD9.99-99.99
Payment Terms :T/T/Paypal
Supply Ability :50000 pieces per month
Delivery Time :10 working days
Packaging Details :Vacuum
NUMBER OF LAYERS :2
GLASS EPOXY :RF-35TC 0.762mm
FINAL HEIGHT OF PCB :0.8 mm ±0.1
FINAL FOIL EXTERNAL :1.5oz
SURFACE FINISH :ENIG
SOLDER MASK COLOR :Green, PSR-2000GT600D, Taiyo Supplied.
COLOUR OF COMPONENT LEGEND :White, IJR-4000 MW300, Taiyo brand
TEST :100% Electrical Test Prior Shipment
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Materials for RF laminates constructed on Taconic RF-35TC PCB Manufacturer 30 mil 0.762 mm

with black solder mask for antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RF-35TC from Taconic company sets a benchmark in high-frequency materials, offering an unparalleled low

dissipation factor coupled with high thermal conductivity. Tailored for high-power applications where even a

tenth of a decibel is critical, this material excels in diffusing heat away from transmission lines and surface

mount components like transistors.

Crafted from a PTFE-based composition, RF-35TC features a ceramic-filled fiberglass substrate. Unlike its

hydrocarbon counterparts, it remains resistant to oxidation, yellowing, and the upward drift in dielectric constant

and dissipation factor over time.

With a low dielectric constant of 3.50 and an exceptionally low Df of 0.0011, this laminate ensures minimal

signal loss and efficient heat dissipation. Its strong bond with low-profile copper further minimizes insertion

loss, enhancing overall performance.

RF-35TC laminates find their optimal use in diverse applications such as antennas, satellites, filters, couplers,

and power amplifiers, where reliability, thermal management, and high performance are of paramount importance.

Materials for RF laminates constructed on Taconic RF-35TC PCB Manufacturer 30 mil 0.762 mm with black soldermask

PCB Specifications

PCB SIZE 90 x 45mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RF-35TC 0.762mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 5 mil
Minimum / Maximum Holes: 0.4 mm / 5.5 mm
Number of Different Holes: 9
Number of Drill Holes: 21
Number of Milled Slots: 1
Number of Internal Cutouts: 1
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RF-35TC 0.762mm
Final foil external: 1.5 oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1
PLATING AND COATING
Surface Finish ENIG
Solder Mask Apply To: TOP, 12micron Minimum
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Materials for RF laminates constructed on Taconic RF-35TC PCB Manufacturer 30 mil 0.762 mm with black soldermask

Data Sheet of RF-35TC

RF-35TC TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.5.1(modified) 3.5 3.5
Tck(-30 to 120℃) IPC-650 2.5.5.5.1(modified) ppm 24 ppm 24
Df @10 GHz IPC-650 2.5.5.5.1(modified) 0.0011 0.0011
Dielectric Breakdown IPC-650 2.5.6(in-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149(Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 12,900 N/mm2 88.94
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 11,700 N/mm2 80.67
Tensile Strength(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 9,020 N/mm2 62.19
Tensile Strength(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 7,740 N/mm2 53.37
Elongation at Break(MD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.89 N/mm 1.89
Elongation at Break(CD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.7 % 1.7
Young's Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 637,000 N/mm2 4,392
Poisson's Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19 0.18 0.18
Poisson's Ratio(CD) ASTM D 3039/IPC-TM-650 2.4.19 0.23 0.18
Compressive Modulus ASTM D 695(23) psi 560,000 N/mm2 3,861
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 1.46 x 106 N/mm2 10,309
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 1.50 x 106 N/mm2 10,076
Peel Stength(½ oz.CVH) IPC-650 2.4.8(Thermal Stress.) Ibs./inch 7 g/cm3 1.25
Thermal Conductivity(Unclad,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.6 W/(mK) 0.6
Thermal Conductivity(C1/C1,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
Thermal Conductivity(CH/CH,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. -0.04 mm/M -0.04
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 8.33 x 107 Mohms 8.33 x 107
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE(X axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 11 ppm/ 11
CTE(Y axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 13 ppm/ 13
CTE(Z axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 34 ppm/ 34
Density ASTM D 792 g/cm3 2.35 g/cm3 2.35
Hardness ASTM D 2240(Shore D) 79.1 79.1
Strain at Break(MD) ASTM D 790/IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break(CD) ASTM D 790/IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05,E 967-08,E968-02 j/(g) 0.94 j/(g) 0.94
Td(2% Weight Loss) IPC-650 2.4.24.6/TGA oF 788 420
Td(5% Weight Loss) IPC-650 2.4.24.6/TGA oF 817 436

Materials for RF laminates constructed on Taconic RF-35TC PCB Manufacturer 30 mil 0.762 mm with black soldermask

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