Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG for involving high power

Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG

for applications involving high power radiofrequency and microwaves.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RT/duroid 6035HTC by Rogers Corporation:

1.Product Description:
RT/duroid 6035HTC, part of Rogers Corporation's high-frequency circuit materials, is a premium ceramic-filled

PTFE composite tailored for high-power RF and microwave applications.

2.Key Advantages:

Enhanced Thermal Conductivity: Boasting a thermal conductivity almost 2.4 times that of standard RT/duroid 6000

products, RT/duroid 6035HTC excels in efficiently dissipating heat, critical for high-power scenarios.

3.Copper Foil Stability: Featuring copper foil with electrodeposited and reverse treatment, this material ensures

outstanding long-term thermal stability, guaranteeing consistent performance over extended periods.

4.Ideal Applications:
RT/duroid 6035HTC laminates are the go-to choice for high-power applications where reliable heat management is

paramount. Its superior thermal conductivity and stable copper foil make it a preferred solution for demanding RF

and microwave environments.

5.Conclusion:
Rogers Corporation's RT/duroid 6035HTC sets a high standard in high-frequency circuit materials, offering exceptional

heat dissipation capabilities and long-term stability. This makes it a top choice for high-power RF and microwave

applications that demand reliability and efficiency.

Features/Benefits:

1.High Thermal Conductivity:
Enhanced dielectric heat dissipation facilitates lower operating temperatures, ideal for high-power applications.

2.Low Loss Tangent:
Exceptional high-frequency performance due to minimal loss tangent, ensuring efficient signal transmission.

3.Thermally Stable Copper Foil:
Utilization of low-profile and reverse-treated copper foil results in reduced insertion loss and excellent thermal

stability of traces.

Advanced Filler System:
Incorporation of an advanced filler system enhances drillability and prolongs tool life compared to alumina-containing

circuit materials.

Typical Applications:

1.High Power RF and Microwave Amplifiers:
Ideal for applications requiring robust thermal management and high power handling capabilities in RF and microwave

amplifier circuits.

2.Power Amplifiers, Couplers, Filters:
Well-suited for power amplifiers, couplers, and filters where low loss tangent and stable thermal characteristics are

essential for optimal performance.

3.Combiners, Power Dividers:
Suitable for combiners and power dividers necessitating reliable thermal stability and efficient signal transmission in

high-power settings.

PCB Capability (RT/duroid 6035HTC)

Data Sheet of RT/duroid 6035HTC