Bicheng Technologies Limited

M4, TC350

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Double Layer PCB Special Material Rogers Board 20.7mil Rogers Ro4003c Lopro Reverse Treated Foil for Low Noise Block

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Bicheng Technologies Limited
City:hong kong
Province/State:guangdong
Country/Region:china
Contact Person:MrsNatalie Xue
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Double Layer PCB Special Material Rogers Board 20.7mil Rogers Ro4003c Lopro Reverse Treated Foil for Low Noise Block

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Brand Name :Bicheng Technologies Limited
Model Number :BIC-0131-N0.131
Certification :UL
Place of Origin :China
MOQ :1
Price :USD9.99-99.99
Payment Terms :T/T/Paypal
Supply Ability :50000 pieces per month
Delivery Time :10 working days
Packaging Details :Vacuum
NUMBER OF LAYERS :2
GLASS EPOXY :RO4003C LoPro
FINAL HEIGHT OF PCB :1.2mm
FINAL FOIL EXTERNAL :1.0oz
SURFACE FINISH :Immersion Gold
SOLDER MASK COLOR :White
COLOUR OF COMPONENT LEGEND :N/A
TEST :100% Electrical Test prior shipment
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Double Layer PCB Special Material Rogers Board 20.7mil Rogers Ro4003c Lopro Reverse Treated

Foil for Low Noise Block, 1.2mm thick.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RO4003C LoPro Laminates by Rogers Corporation:

Product Description:
RO4003C LoPro laminates utilize Rogers' proprietary technology, enabling the bonding of reverse treated foil

to the standard RO4003C dielectric. This results in a laminate with minimal conductor loss, enhancing insertion

loss characteristics and signal integrity while retaining all other favorable attributes of the standard RO4003C

system.

Double Layer PCB Special Material Rogers Board 20.7mil Rogers Ro4003c Lopro Reverse Treated Foil for Low Noise Block

Features and Benefits:

Reinforced Hydrocarbon/Ceramic Laminates: RO4003C materials feature reinforced hydrocarbon/ceramic

composition with a low-profile reverse treated foil.


Lower Insertion Loss: Reduced conductor loss leads to lower insertion loss, improving signal transmission

efficiency.


Low PIM (Passive Intermodulation): Enhanced design minimizes passive intermodulation effects, ensuring

signal purity.


Increased Signal Integrity: Maintains high signal integrity, crucial for reliable performance in high-frequency

applications.


High Circuit Density: Supports high circuit density layouts, enabling compact and efficient PCB designs.


Low Z-Axis Coefficient of Thermal Expansion:
Multi-Layer Board Capability: Facilitates the construction of multi-layer boards without compromising performance.
Design Flexibility: Offers design flexibility for complex PCB layouts and diverse applications.


Lead-Free Process Compatible:
High-Temperature Processing: Compatible with high-temperature processes, ensuring robust performance under

varying conditions.


Environmental Compliance: Meets environmental standards by providing a lead-free solution, addressing environmental concerns and regulations effectively.

Double Layer PCB Special Material Rogers Board 20.7mil Rogers Ro4003c Lopro Reverse Treated Foil for Low Noise Block

Our PCB Capability (RO4003C LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Typical Applications:

1.Digital Applications:
RO4003C LoPro laminates are well-suited for digital applications like servers, routers, and high-speed backplanes,

ensuring reliable signal transmission and low insertion loss in data processing systems.


2.Cellular Base Station Antennas and Power Amplifiers:
Ideal for cellular base station antennas and power amplifiers, providing high signal integrity and performance crucial

for robust wireless communication networks.


3.LNBs for Direct Broadcast Satellites:
Utilized in Low-Noise Blocks (LNBs) for direct broadcast satellites, optimizing signal reception and processing for satellite TV and communication services.


4.RF Identification Tags:
Used in RF identification tags, facilitating accurate and efficient data exchange for identification and tracking purposes in various industries and applications.

Typical Properties of RO4003C LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 40 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 X 1010 MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 X 109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40) MPa(kpsi) IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280 °C TMA A IPC-TM-650 2.4.24.3
Td 425 °C TGA ASTM D3850
Thermal Conductivity 0.64 W/m/°K 80°C ASTM C518
Moisture Absorption 0.06 % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79 gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0) N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-Free Process Compatible Yes


Double Layer PCB Special Material Rogers Board 20.7mil Rogers Ro4003c Lopro Reverse Treated Foil for Low Noise Block

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