Bicheng Technologies Limited
M4, TC350
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Rogers PCB RT/Duroid 5870 for Digital Radio, material substrate 62 mil no thru copper covered with
ENIG and green soldermask
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RT/duroid 5870 is a high-frequency material renowned for its exceptional properties. It consists
of glass microfiber reinforced PTFE composites specifically crafted for demanding stripline and microstrip
circuit applications. The uniform dielectric constant of RT/duroid 5870 stems from its randomly oriented
microfibers, ensuring consistency from panel to panel across a broad frequency spectrum.
With a low dissipation factor, RT/duroid 5870 extends its utility to the Ku-band and beyond. These materials
can be easily manipulated through cutting, shearing, and machining, retaining their integrity. They exhibit
resistance to a variety of solvents and reagents, whether hot or cold, typically used in circuit etching and
plating processes.
Common applications for RT/duroid 5870 include commercial airline broadband antennas, microstrip and
stripline circuits, millimeter wave technologies, military radar and missile guidance systems, as well as
point-to-point digital radio antennas. The versatility and reliability of RT/duroid 5870 make it a preferred
choice for high-frequency circuit applications across various industries.
PCB Specifications
| PCB SIZE | 120 x 75mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RT/Duroid 5870 1.575mm | |
| copper ------- 18um(0.5oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 9 mil / 4 mil |
| Minimum / Maximum Holes: | 0.3 mm / 1.0mm |
| Number of Different Holes: | 3 |
| Number of Drill Holes: | 92 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RT/Duroid 5870 1.575mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 1.6 mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.25mm. Via tented. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers RT/duroid 5870
| RT/duroid 5870 Typical Value | ||||||
| Property | RT/duroid 5870 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.33 2.33±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.33 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0005 0.0012 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Thermal Coefficient of ε | -115 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1300(189) | 490(71) | X | ||||
| 1280(185) | 430(63) | Y | ||||
| Ultimate Stress | 50(7.3) | 34(4.8) | X | |||
| 42(6.1) | 34(4.8) | Y | ||||
| Ultimate Strain | 9.8 | 8.7 | X | % | ||
| 9.8 | 8.6 | Y | ||||
| Compressive Modulus | 1210(176) | 680(99) | X | MPa(kpsi) | A | ASTM D 695 |
| 1360(198) | 860(125) | Y | ||||
| 803(120) | 520(76) | Z | ||||
| Ultimate Stress | 30(4.4) | 23(3.4) | X | |||
| 37(5.3) | 25(3.7) | Y | ||||
| 54(7.8) | 37(5.3) | Z | ||||
| Ultimate Strain | 4 | 4.3 | X | % | ||
| 3.3 | 3.3 | Y | ||||
| 8.7 | 8.5 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.22 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 22 28 173 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 27.2(4.8) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |