Bicheng Technologies Limited
M4, TC350
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Dual Layer Rogers PCB Built on 60.7mil RO4350B LoPro Reverse Treated Foil With ENIG for High Speed
Back Planes
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
The RO4350B LoPro laminates leverage a proprietary technology from Rogers that enables the
bonding of reverse treated foil to the standard RO4350B dielectric material. This unique process
yields a laminate characterized by low conductor loss, enhancing insertion loss performance and
signal integrity.
Despite the reduction in conductor loss, the RO4350B LoPro laminate preserves all the other favorable
characteristics of the standard RO4350B system. This innovative approach ensures that the laminate
maintains its integrity and reliability while offering improved signal transmission properties, making it
an ideal choice for high-performance applications where low insertion loss and signal fidelity are critical.
Features and Benefits of RO4350B Laminates:
Material Composition:
RO4350B laminates consist of reinforced hydrocarbon/ceramic materials with a low-profile reverse treated foil,
offering exceptional performance characteristics.
Electrical Performance:
Lower Insertion Loss: Reduced conductor loss translates to lower insertion loss, enhancing signal transmission
efficiency.
Low PIM (Passive Intermodulation): Minimized passive intermodulation distortion ensures cleaner signal output.
Increased Signal Integrity: Improved signal fidelity and reduced signal degradation for reliable data transmission.
High Circuit Density: Enables the design of high-density circuits with optimized performance.
Thermal Properties:
Low Z-Axis Coefficient of Thermal Expansion: Ensures thermal stability and reliability, particularly crucial for temperature-sensitive applications.
Multi-Layer Board Capability: Supports multi-layer board designs, enhancing complexity and functionality.
Design Flexibility: Offers designers the freedom to create intricate circuit layouts and configurations.
Process Compatibility:
Lead-Free Process Compatible: Supports high-temperature processing methods while meeting lead-free
requirements, ensuring compliance with modern manufacturing standards.
High-Temperature Processing: Capable of withstanding high-temperature manufacturing processes without
compromising performance.
Environmental Considerations:
Meets Environmental Concerns: Designed to address environmental regulations and sustainability requirements,
ensuring eco-friendly operation.
CAF Resistant: Resistant to Conductive Anodic Filament (CAF) formation, enhancing the durability and longevity
of the laminate in diverse operating conditions.
RO4350B laminates offer a comprehensive set of features and benefits, combining exceptional electrical performance,
thermal stability, process compatibility, and environmental sustainability, making them a versatile and reliable choice
for a wide range of high-frequency circuit applications.
Our PCB Capability (RO4350B LoPro)
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4350B LoPro |
| Dielectric constant: | 3.48±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
Typical Properties of RO4350B LoPro
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant, Process | 3.48 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design | 3.55 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factor tan, | 0.0037 0.0031 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r | 50 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 11473(1664) | Y | MPa(kpsi) | RT | ASTM D638 |
| Tensile Strength | 175(25.4) | Y | MPa(kpsi) | RT | ASTM D638 |
| Flexural Strength | 255(37) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion | 14 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| 16 | y | ||||
| 35 | z | ||||
| Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | °C TGA | ASTM D3850 | ||
| Thermal Conductivity | 0.62 | W/m/°K | 80°C | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
| Density | 1.86 | gm/cm3 | 23°C | ASTM D792 | |
| Copper Peel Strength | 0.88(5.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes |