Bicheng Technologies Limited
M4, TC350
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Double Layer Rogers PCB Built on 60.7mil RO4003C LoPro Reverse Treated Foil for Power Amplifiers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4003C LoPro laminates incorporate an innovative technology developed by Rogers that facilitates the bonding
of reverse treated foil to the standard RO4003C dielectric material. This advanced manufacturing process produces
a laminate characterized by minimal conductor loss, leading to enhanced insertion loss performance and superior
signal integrity.
Despite the reduction in conductor loss, the RO4003C LoPro laminate retains all the other highly desirable
characteristics of the standard RO4003C laminate system. This ensures that the laminate maintains its
exceptional properties and reliability while offering improved signal transmission capabilities, making it
an ideal choice for applications where low insertion loss and uncompromised signal fidelity are paramount.
Features and Benefits:
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
Our PCB Capability (RO4003C LoPro)
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4003C LoPro |
| Dielectric constant: | 3.38±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
Typical Properties of RO4003C LoPro
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant, Process | 3.38 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design | 3.5 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factor tan, | 0.0027 0.0021 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r | 40 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 26889(3900) | Y | MPa(kpsi) | RT | ASTM D638 |
| Tensile Strength | 141(20.4) | Y | MPa(kpsi) | RT | ASTM D638 |
| Flexural Strength | 276(40) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion | 11 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| 14 | y | ||||
| 46 | z | ||||
| Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | °C TGA | ASTM D3850 | ||
| Thermal Conductivity | 0.64 | W/m/°K | 80°C | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
| Density | 1.79 | gm/cm3 | 23°C | ASTM D792 | |
| Copper Peel Strength | 1.05(6.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-Free Process Compatible | Yes |