Bicheng Technologies Limited
M4, TC350
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Taconic TLY High Frequency PCB with TLY-5, TLY-5-L, TLY-3, TLY-3FF Coating with HASL,
Immersion Gold, OSP and Tin
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today, we're highlighting high-frequency PCBs constructed using TLY material, a specialized laminate
manufactured by Taconic Company.
TLY laminates are crafted with ultra-lightweight woven fiberglass, distinguishing them from chopped fiber
reinforced PTFE composites. This unique composition imparts exceptional dimensional stability to the
material, making it an excellent choice for applications requiring precision and consistency. The enhanced
mechanical stability of TLY laminates renders them well-suited for high-volume manufacturing processes,
ensuring reliability and efficiency in production.
One of the key advantages of TLY laminates is their low dissipation factor, which plays a critical role in the
successful deployment of these materials in demanding applications such as automotive radar systems
operating at 77 GHz and various antenna designs for millimeter-wave frequencies. This characteristic
enables the efficient transmission of high-frequency signals with minimal loss, making TLY laminates
an optimal solution for advanced radar and communication systems requiring superior performance
and reliability.
The utilization of TLY material offers a multitude of advantages, enhancing the performance and
reliability of high-frequency PCBs:
1.Dimensional Stability: TLY laminates exhibit exceptional dimensional stability, enabling high-volume
fabrication processes with consistent results.
2.Lowest Dissipation Factor (DF): Within the low dielectric constant spectrum, TLY demonstrates an
impressively low dissipation factor of approximately 0.0009 at 10 GHz, ensuring minimal signal loss
and maintaining signal integrity.
3.Low Moisture Absorption: TLY's low moisture absorption rate allows for reliable operation in harsh
environmental conditions, making it suitable for applications where moisture resistance is critical.
4.High Copper Peel Strength: With a robust copper peel strength reaching up to 2.32, TLY laminates
offer strong adhesion properties, contributing to their dimensional stability and reliability in various
operating conditions.
5.Uniform and Consistent Dielectric Constant (DK): TLY laminates provide uniform and consistent
dielectric constant values. Across different thicknesses, the dielectric constant can be precisely
specified within a tight tolerance of +/-0.02, ensuring predictable electrical performance and
facilitating design precision in high-frequency applications.
The TLY material family offers a diverse range of high-performance laminates tailored to meet
specific application requirements. While TLY-5 is readily available in stock, the other variants
within the TLY family can be procured based on clients' specific needs and preferences.
Typical Applications for TLY Laminates:
1.Automotive Radar: Utilized in radar systems for automotive applications.
2.Cellular Communications: Supporting components in cellular network infrastructure.
3.Satellite Communications: Essential for satellite communication systems.
4.Power Amplifiers, Filters, Couplers: Integral components in RF and microwave circuits.
5.LNBs, LNAs, LNCs: Key elements in low-noise blocks, amplifiers, and converters.
6.Aerospace, Avionics: Employed in aerospace and avionics systems for reliable performance.
7.Phased Array Antennas: Essential for phased array antenna systems for communication and radar applications.
The versatility and performance characteristics of the TLY laminates make them suitable for a wide range
of applications across various industries. By offering multiple members within the TLY family and stocking
TLY-5, we ensure flexibility and customization to meet the unique requirements of our clients in diverse
high-frequency applications.
Our PCB Capability (TLY)
| PCB Material: | Lightweight Woven Fiberglass |
| TLY Family (Dielectric constant ±0.02) | TLY-5A (DK=2.17) |
| TLY-5A-L (DK=2.17) | |
| TLY-5 (DK=2.20) | |
| TLY-5-L (DK=2.20) | |
| TLY-3 (DK=2.33) | |
| TLY-3FF (DK=2.33) | |
| Layer count: | 1 Layer, 2 Layer, 4 Layer. |
| Copper weight: | 0.5oz, 1oz, 2oz |
| PCB thickness: | 0.2mm, 0.3mm, 0.6mm, |
| 0.8mm, 1.6mm | |
| PCB Size: | ≤400mm X 500mm |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin etc. |
Bicheng specializes in offering a comprehensive range of services, including prototype development,
small batch production, and mass production for your PCB needs. Our expertise and capabilities
enable us to cater to various project scales, ensuring quality and efficiency throughout the production
process.
If you have any inquiries or require further information about our services, please do not hesitate to
reach out to us. We are here to assist you with your PCB requirements and provide tailored solutions
to meet your specific needs.
Thank you for taking the time to read about our offerings. We look forward to the opportunity to support
your projects and deliver high-quality PCB solutions to meet your requirements.
Appendix: Typical Values of TLY
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5 | 2.2 | 2.2 | ||
| Df at 10 GHz | IPC-650 2.5.5.5 | 0.0009 | 0.0009 | ||
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
| Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
| Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
| Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
| Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
| Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
| Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
| Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | 0.21 | 0.21 | ||
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
| Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | -0.038 | |
| Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | -0.031 | |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
| CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
| CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
| CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
| NASA Outgassing(% TML) | 0.01 | 0.01 | |||
| NASA Outgassing(% CVCM) | 0.01 | 0.01 | |||
| NASA Outgassing(% WVR) | 0.00 | 0.00 | |||
| UL-94 Flammability Rating | UL-94 | V-0 | V-0 |