Bicheng Technologies Limited

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Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas

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Bicheng Technologies Limited
City:hong kong
Province/State:guangdong
Country/Region:china
Contact Person:MrsNatalie Xue
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Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas

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Brand Name :Bicheng Technologies Limited
Model Number :BIC-051-N0.51
Certification :UL
Place of Origin :China
MOQ :1
Price :USD9.99-99.99
Payment Terms :T/T/Paypal
Supply Ability :50000 pieces per month
Delivery Time :10 working days
Packaging Details :Vacuum
NUMBER OF LAYERS :2
GLASS EPOXY :RT/duroid 6002 0.254mm
FINAL HEIGHT OF PCB :0.3 mm ±0.1mm
FINAL FOIL EXTERNAL :1.0oz
SURFACE FINISH :Immersion gold
SOLDER MASK COLOR :NO
COLOUR OF COMPONENT LEGEND :NO
TEST :100% Electrical Test Prior Shipment
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Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased

Array Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RT/duroid 6002 microwave material stands out as a pioneering laminate, offering a unique combination

of low loss and low dielectric constant properties that are essential for designing intricate microwave structures

with superior electrical and mechanical characteristics. These features ensure both mechanical reliability and

electrical stability, crucial in demanding microwave applications.

Key features and benefits of Rogers RT/duroid 6002 material include:

1.Thermal Stability: The material exhibits an extremely low thermal coefficient of dielectric constant across a

wide temperature range from -55°C to +150°C. This stability is vital for applications such as filters, oscillators,

and delay lines, where precise electrical performance is essential.


2.Z-Axis Coefficient of Thermal Expansion (CTE): The low Z-axis CTE ensures the reliability of plated through

holes, contributing to the overall durability and performance of the material in challenging thermal environments.


3.Reliability: RT/duroid 6002 materials have demonstrated exceptional reliability through temperature cycling

tests (-55°C to 125°C) for over 5000 cycles without any via failures, highlighting the material's robust construction.


4.Dimensional Stability: Achieving excellent dimensional stability (0.2 to 0.5 mils/inch) is facilitated by matching

the coefficient of expansion in the X and Y directions to that of copper. This alignment often eliminates the need

for double etching, streamlining manufacturing processes and improving positional tolerances.


5.Reduced Stress on Solder Joints: The low tensile modulus in the X and Y directions reduces stress on solder

joints, enhancing the overall reliability of surface mount assemblies. The constrained expansion of the laminate,

coupled with low CTE metal, further enhances surface mount reliability by minimizing mismatch-induced stresses.


Overall, Rogers RT/duroid 6002 material offers a comprehensive solution for high-frequency applications, combining exceptional electrical properties with mechanical robustness to meet the stringent requirements of modern microwave

designs.

Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas

The unique properties of RT/duroid 6002 material make it well-suited for a variety of applications that

require high performance in challenging environments. Some typical applications include:

Airborne Radar Systems: Utilized in radar systems for aircraft navigation and surveillance applications.


Beam Forming Networks: Essential for beamforming applications in communication and radar systems.


Commercial Airline Collision Avoidance: Critical for systems designed to enhance safety and prevent

collisions in commercial aviation.


Global Positioning Systems Antennas: Used in GPS antenna systems for accurate positioning and navigation.


Ground Base Systems: Deployed in ground-based communication and radar systems for various applications.


High-Reliability Complex Multi-layer Circuits: Ideal for intricate multi-layer circuit designs requiring reliability

and performance.


Phased Array Antennas: Employed in phased array antenna systems for communication and radar applications.


Power Backplanes: Utilized in power distribution systems for efficient and reliable power management in electronic

devices.


The exceptional electrical and mechanical properties of RT/duroid 6002 material make it a preferred choice for

applications such as aerospace designs in hostile environments, where reliability, stability, and high performance

are paramount. Its suitability for flat and non-planar structures, as well as its compatibility with complex multi-layer

circuits, further expands its versatility in various high-frequency and microwave applications.

PCB Specifications

PCB SIZE 78 x 77 mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RT/duroid 6002 0.254mm
copper ------- 35um(1 oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space: 10 mil / 10 mil
Minimum / Maximum Holes: 0.3 mm / 0.6 mm
Number of Different Holes: 1
Number of Drill Holes: 2
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RT/duroid 6002 0.254mm
Final foil external: 1 oz
Final foil internal: 1 oz
Final height of PCB: 0.3 mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold (51.3% ) 0.05µm over 3µm nickel
Solder Mask Apply To: NO
Solder Mask Color: NO
Solder Mask Type: NO
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Data Sheet of Rogers 6002 (RT/duroid 6002)

Property RT/duroid 6002 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.94±0.04 Z 10 GHz/23 IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.94 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0012 Z 10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +12 Z ppm/ 10 GHz 0-100 IPC-TM-650 2.5.5.5
Volume Resistivity 106 Z Mohm.cm A ASTM D 257
Surface Resistivity 107 Z Mohm A ASTM D 257
Tensile Modulus 828(120) X,Y MPa(kpsi) 23 ASTM D 638
Ultimate Stress 6.9(1.0) X,Y MPa(kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482(360) Z MPa(kpsi) ASTM D 638
Moisture Absorption 0.02 % D48/50 IPC-TM-650 2.6.2.1
ASTM D 570
Thermal Conductivity 0.6 W/m/k 80 ASTM C518
Coefficient of Thermal Expansion
(-55 to 288
)
16
16
24
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.41
Td 500 TGA ASTM D 3850
Density 2.1 gm/cm3 ASTM D 792
Specific Heat 0.93(0.22) j/g/k
(BTU/ib/
OF)
Calculated
Copper Peel 8.9(1.6) Ibs/in.(N/mm) IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas

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