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Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased
Array Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RT/duroid 6002 microwave material stands out as a pioneering laminate, offering a unique combination
of low loss and low dielectric constant properties that are essential for designing intricate microwave structures
with superior electrical and mechanical characteristics. These features ensure both mechanical reliability and
electrical stability, crucial in demanding microwave applications.
Key features and benefits of Rogers RT/duroid 6002 material include:
1.Thermal Stability: The material exhibits an extremely low thermal coefficient of dielectric constant across a
wide temperature range from -55°C to +150°C. This stability is vital for applications such as filters, oscillators,
and delay lines, where precise electrical performance is essential.
2.Z-Axis Coefficient of Thermal Expansion (CTE): The low Z-axis CTE ensures the reliability of plated through
holes, contributing to the overall durability and performance of the material in challenging thermal environments.
3.Reliability: RT/duroid 6002 materials have demonstrated exceptional reliability through temperature cycling
tests (-55°C to 125°C) for over 5000 cycles without any via failures, highlighting the material's robust construction.
4.Dimensional Stability: Achieving excellent dimensional stability (0.2 to 0.5 mils/inch) is facilitated by matching
the coefficient of expansion in the X and Y directions to that of copper. This alignment often eliminates the need
for double etching, streamlining manufacturing processes and improving positional tolerances.
5.Reduced Stress on Solder Joints: The low tensile modulus in the X and Y directions reduces stress on solder
joints, enhancing the overall reliability of surface mount assemblies. The constrained expansion of the laminate,
coupled with low CTE metal, further enhances surface mount reliability by minimizing mismatch-induced stresses.
Overall, Rogers RT/duroid 6002 material offers a comprehensive solution for high-frequency applications, combining exceptional electrical properties with mechanical robustness to meet the stringent requirements of modern microwave
designs.
The unique properties of RT/duroid 6002 material make it well-suited for a variety of applications that
require high performance in challenging environments. Some typical applications include:
Airborne Radar Systems: Utilized in radar systems for aircraft navigation and surveillance applications.
Beam Forming Networks: Essential for beamforming applications in communication and radar systems.
Commercial Airline Collision Avoidance: Critical for systems designed to enhance safety and prevent
collisions in commercial aviation.
Global Positioning Systems Antennas: Used in GPS antenna systems for accurate positioning and navigation.
Ground Base Systems: Deployed in ground-based communication and radar systems for various applications.
High-Reliability Complex Multi-layer Circuits: Ideal for intricate multi-layer circuit designs requiring reliability
and performance.
Phased Array Antennas: Employed in phased array antenna systems for communication and radar applications.
Power Backplanes: Utilized in power distribution systems for efficient and reliable power management in electronic
devices.
The exceptional electrical and mechanical properties of RT/duroid 6002 material make it a preferred choice for
applications such as aerospace designs in hostile environments, where reliability, stability, and high performance
are paramount. Its suitability for flat and non-planar structures, as well as its compatibility with complex multi-layer
circuits, further expands its versatility in various high-frequency and microwave applications.
PCB Specifications
PCB SIZE | 78 x 77 mm=1PCS |
BOARD TYPE | Double sided PCB |
Number of Layers | 2 layers |
Surface Mount Components | YES |
Through Hole Components | NO |
LAYER STACKUP | copper ------- 35um(1 oz)+plate TOP layer |
RT/duroid 6002 0.254mm | |
copper ------- 35um(1 oz)+plate BOT layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 10 mil / 10 mil |
Minimum / Maximum Holes: | 0.3 mm / 0.6 mm |
Number of Different Holes: | 1 |
Number of Drill Holes: | 2 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | RT/duroid 6002 0.254mm |
Final foil external: | 1 oz |
Final foil internal: | 1 oz |
Final height of PCB: | 0.3 mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion gold (51.3% ) 0.05µm over 3µm nickel |
Solder Mask Apply To: | NO |
Solder Mask Color: | NO |
Solder Mask Type: | NO |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | N/A |
Colour of Component Legend | N/A |
Manufacturer Name or Logo: | N/A |
VIA | Plated through hole(PTH), minimum size 0.3mm. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 6002 (RT/duroid 6002)
Property | RT/duroid 6002 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 2.94±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Dielectric Constant,εDesign | 2.94 | 8GHz to 40 GHz | Differential Phase Length Method | ||
Dissipation Factor,tanδ | 0.0012 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +12 | Z | ppm/℃ | 10 GHz 0℃-100℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 106 | Z | Mohm.cm | A | ASTM D 257 |
Surface Resistivity | 107 | Z | Mohm | A | ASTM D 257 |
Tensile Modulus | 828(120) | X,Y | MPa(kpsi) | 23℃ | ASTM D 638 |
Ultimate Stress | 6.9(1.0) | X,Y | MPa(kpsi) | ||
Ultimate Strain | 7.3 | X,Y | % | ||
Compressive Modulus | 2482(360) | Z | MPa(kpsi) | ASTM D 638 | |
Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 ASTM D 570 | |
Thermal Conductivity | 0.6 | W/m/k | 80℃ | ASTM C518 | |
Coefficient of Thermal Expansion (-55 to 288℃) | 16 16 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.1 | gm/cm3 | ASTM D 792 | ||
Specific Heat | 0.93(0.22) | j/g/k (BTU/ib/OF) | Calculated | ||
Copper Peel | 8.9(1.6) | Ibs/in.(N/mm) | IPC-TM-650 2.4.8 | ||
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |