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Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable
Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for
reference)
The Rogers RO3035 high-frequency circuit materials are ceramic-filled PTFE composites developed
for commercial microwave and RF applications. These materials are designed to offer exceptional
electrical and mechanical stability at competitive prices, making them ideal for a variety of high
-frequency applications. The key features and typical applications of RO3035 materials are as
follows:
Key Features:
Consistent Mechanical Properties: RO3035 materials provide consistent mechanical properties,
enabling the design of multi-layer boards without warping or reliability issues.
Thermal Expansion Properties: The material exhibits a coefficient of thermal expansion (CTE) of
17 ppm/°C in the X and Y axes, matched to copper. This alignment ensures excellent dimensional
stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking.
Z-Axis CTE: With a Z-axis CTE of 24 ppm/°C, RO3035 materials offer exceptional reliability for plated
through-holes, even in severe environmental conditions.
Typical Applications:
Automotive Radar: Used in radar systems for automotive applications.
Cellular Telecommunications Systems: Employed in cellular network infrastructure.
Datalink on Cable Systems: Utilized for data transmission in cable systems.
Direct Broadcast Satellites: Integral in direct satellite communication and broadcasting.
Global Positioning Satellite Antennas: Essential for GPS antenna systems.
Patch Antennas for Wireless Communications: Critical for wireless communication systems.
Power Amplifiers and Antennas: Used in RF power amplification and antenna systems.
Power Backplanes: Deployed in power distribution systems for efficient power management.
Remote Meter Readers: Applied in systems for remote data collection and monitoring.
The versatility and reliability of RO3035 materials make them well-suited for a wide range of high-frequency
applications, providing excellent electrical properties, mechanical stability, and reliability even in demanding
environments.
PCB Specifications
PCB SIZE | 140 x 52mm=20PCS |
BOARD TYPE | Double sided PCB |
Number of Layers | 2 layers |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
RO3035 0.762mm | |
copper ------- 18um(0.5 oz) + plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 4 mil / 4 mil |
Minimum / Maximum Holes: | 0.5 mm / 5.0 mm |
Number of Different Holes: | 11 |
Number of Drill Holes: | 125 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | RO3035 0.762mm |
Final foil external: | 1oz |
Final foil internal: | N/A |
Final height of PCB: | 0.8 mm ±0.1mm |
PLATING AND COATING | |
Surface Finish | Immersion Gold |
Solder Mask Apply To: | N/A |
Solder Mask Color: | N/A |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | N/A |
Colour of Component Legend | N/A |
Manufacturer Name or Logo: | N/A |
VIA | Plated through hole(PTH), minimum size 0.5mm. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 3035 (RO3035)
Property | RO3035 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.6 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.0015 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -45 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.11 0.11 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 1025 1006 | X Y | MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | j/g/k | Calculated | |||
Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) | 17 17 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 10.2 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |