Bicheng Technologies Limited

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Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

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Bicheng Technologies Limited
City:hong kong
Province/State:guangdong
Country/Region:china
Contact Person:MrsNatalie Xue
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Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

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Brand Name :Bicheng Technologies Limited
Model Number :BIC-043-N0.43
Certification :UL
Place of Origin :China
MOQ :1
Price :USD9.99-99.99
Payment Terms :T/T/Paypal
Supply Ability :50000 pieces per month
Delivery Time :10 working days
Packaging Details :Vacuum
NUMBER OF LAYERS :2
GLASS EPOXY :RO3035 0.762mm
FINAL HEIGHT OF PCB :0.8 mm ±0.1mm
FINAL FOIL EXTERNAL :1.0oz
SURFACE FINISH :Immersion gold
SOLDER MASK COLOR :N/A
COLOUR OF COMPONENT LEGEND :N/A
TEST :100% Electrical Test Prior Shipment
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Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable

Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for

reference)

The Rogers RO3035 high-frequency circuit materials are ceramic-filled PTFE composites developed

for commercial microwave and RF applications. These materials are designed to offer exceptional

electrical and mechanical stability at competitive prices, making them ideal for a variety of high

-frequency applications. The key features and typical applications of RO3035 materials are as

follows:

Key Features:
Consistent Mechanical Properties:
RO3035 materials provide consistent mechanical properties,

enabling the design of multi-layer boards without warping or reliability issues.


Thermal Expansion Properties: The material exhibits a coefficient of thermal expansion (CTE) of

17 ppm/°C in the X and Y axes, matched to copper. This alignment ensures excellent dimensional

stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking.


Z-Axis CTE: With a Z-axis CTE of 24 ppm/°C, RO3035 materials offer exceptional reliability for plated

through-holes, even in severe environmental conditions.


Typical Applications:
Automotive Radar: Used in radar systems for automotive applications.


Cellular Telecommunications Systems: Employed in cellular network infrastructure.


Datalink on Cable Systems: Utilized for data transmission in cable systems.


Direct Broadcast Satellites: Integral in direct satellite communication and broadcasting.


Global Positioning Satellite Antennas: Essential for GPS antenna systems.


Patch Antennas for Wireless Communications: Critical for wireless communication systems.


Power Amplifiers and Antennas: Used in RF power amplification and antenna systems.


Power Backplanes: Deployed in power distribution systems for efficient power management.


Remote Meter Readers: Applied in systems for remote data collection and monitoring.


The versatility and reliability of RO3035 materials make them well-suited for a wide range of high-frequency

applications, providing excellent electrical properties, mechanical stability, and reliability even in demanding

environments.

Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

PCB Specifications

PCB SIZE 140 x 52mm=20PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3035 0.762mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.5 mm / 5.0 mm
Number of Different Holes: 11
Number of Drill Holes: 125
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RO3035 0.762mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1mm
PLATING AND COATING
Surface Finish Immersion Gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

Data Sheet of Rogers 3035 (RO3035)

Property RO3035 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z 10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0015 Z 10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -45 Z ppm/ 10 GHz -50to 150 IPC-TM-650 2.5.5.5
Dimensional Stability 0.11
0.11
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 1025
1006
X
Y
MPa 23 ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
17
24
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500 TGA ASTM D 3850
Density 2.1 gm/cm3 23 ASTM D 792
Copper Peel Stength 10.2 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

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