Bicheng Technologies Limited
M4, TC350
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Rogers PCB Made on RO3035 10mil 0.254mm DK3.5 with Immersion Gold for Patch Antenna for
Wireless Communications
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Given the properties and typical applications of Rogers RO3035 high-frequency circuit materials, here is a
summary:
Properties of RO3035 Material:
Composition: Ceramic-filled PTFE composites.
Stability: Exceptional electrical and mechanical stability.
Mechanical Properties: Consistent, enabling multi-layer board designs without warping issues.
Thermal Expansion:
X and Y Axis: 17 ppm/°C (matched to copper for dimensional stability).
Z Axis: 24 ppm/°C, ensuring plated through-hole reliability.
Typical Applications:
Automotive Radar: Used in radar systems for automotive applications.
Cellular Telecommunications Systems: Employed in cellular infrastructure for communication.
Datalink on Cable Systems: Utilized for data transmission within cable networks.
Direct Broadcast Satellites: Essential for satellite communication and broadcasting.
Global Positioning Satellite Antennas: Employed in GPS antenna systems for accurate positioning.
Patch Antennas for Wireless Communications: Critical for wireless communication systems.
Power Amplifiers and Antennas: Integral components in RF power amplification and antenna systems.
Power Backplanes: Used in power distribution systems for efficient power management.
Remote Meter Readers: Applied in systems for remote data collection and monitoring.
The exceptional properties of RO3035 materials make them ideal for various commercial microwave and
RF applications where stability, reliability, and performance are crucial. Their compatibility with multi-layer
board designs and dimensional stability make them particularly suitable for applications requiring precision
and consistency in harsh environments.
PCB Specifications
| PCB SIZE | 55 x 57mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RO3035 0.254mm | |
| copper ------- 18um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.4 mm / 5.5 mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | 79 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO3035 0.254mm |
| Final foil external: | 1 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 3035 (RO3035)
| Property | RO3035 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.6 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0015 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -45 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.11 0.11 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1025 1006 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | j/g/k | Calculated | |||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 17 17 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 10.2 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |