Bicheng Technologies Limited
M4, TC350
Add to Cart
4 Layer High Frequency PCB Built On 6.6mil and 20mil RO4350B with Blind Via for Radar Sensor
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)
Hi Everyone,
Multilayer Rogers PCBs are constructed using multiple cores combined, distinguishing them from FR-4
multilayer PCBs. In the RO4350B family, there are 8 cores available, ranging from 4 mil (0.101 mm) to
60 mil (1.524 mm) in thickness. This diversity in core options allows for a wide range of design possibilities
and performance characteristics in Rogers PCBs, setting them apart from traditional FR-4 boards.
| RO4350B: | |
| 4mil | 0.101mm |
| 6.6mil | 0.168mm |
| 10mil | 0.254mm |
| 13.3mil | 0.338mm |
| 16.6mil | 0.422mm |
| 20mil | 0.508mm |
| 30mil | 0.762mm |
| 60mil | 1.524mm |
So it’s very interesting that the stack-up of 4 layers can be configured in numerous ways.
Today, we are focusing on Rogers 4-layer PCBs fabricated using 6.6 mil and 20 mil RO4350B substrates.
Let’s begin by examining the first stack-up configuration.
Layer 1 to Layer 2 comprises the first core of 6.6 mil, while Layer 3 to Layer 4 consists of the second
core of 20 mil. These cores are interconnected through two sheets of RO4450F (1 RO4450F = 4 mil).
This specific board is tailored for radar sensor applications, with a thickness of 1.0 mm and pads featuring
immersion gold plating. It incorporates blind vias from the top layer to the inner layer 1.
Given its asymmetric build, a maximum warpage of 1.2% is permissible. Manufactured in compliance with
IPC 6012 Class 2 standards, this board is produced using provided Gerber data. Each shipment contains
10 boards securely packed for transportation.
The second one is very similar to previous one, the stack-up explains all.
Features and Benefits
Dielectric Constant (DK):
Low and stable DK ensures excellent signal transmission without delay.
Immersion Gold Surface:
Provides exceptional surface planarity, especially beneficial for PCBs with BGA or CSP components,
reducing failure rates during assembly and soldering.
Comprehensive Testing:
Includes electrical tests, AOI inspection, thermal stress tests, reliability tests, insulation resistance tests,
and ionic contamination tests for quality assurance.
Fast and Flexible Production:
Enables quick transition from prototype to standard production, saving valuable time.
Compliance:
UL recognized and RoHS Directive-compliant, ensuring adherence to industry standards.
Why Choose Us?
Focus on Core Competencies:
Let us handle the complexities of PCB manufacturing while you focus on core competencies like research,
development, sales, and marketing.
Cutting-edge Technology:
Access the latest equipment and manufacturing expertise through our three factory bases spanning over
26,000 square meters.
Cost Efficiency:
We prioritize reducing manufacturing costs through equipment upgrades, worker training, and technology
improvements, ensuring quality without compromising profitability.
Quality Assurance:
Our engineering design minimizes quality issues pre-production, resulting in a customer complaint rate of
less than 1%, promptly resolved to your satisfaction.
Time Savings:
Responding to market demands, we offer fast and flexible production schedules, from prototypes to standard
production, ensuring quick turnarounds and scheduled deliveries.
Expert Team:
Trust our passionate, disciplined, responsible, and honest team of experienced salespersons and skilled customer service representatives. Stick with Bicheng for reliability and excellence.